Full Flow Process Integration

MEMS Prototyping
Built for Scalability

We bridge the gap from academic proof-of-concept to commercial volume. Utilizing Tier-1 cleanroom toolsets to develop robust, foundry-ready processes for your next-generation device.

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Bridging the Gap: We specialize in TRL 4–7

We take your academic-scale proof-of-concept and refine it into a robust, repeatable process ready for the commercial market. Our engineering team eliminates "Process Drift" before you scale.

Industry Verticals

Targeted fabrication solutions for high-growth technical markets.

Biotech & Microfluidics

SU-8 Masters • PDMS • Lab-on-a-Chip

Quantum & Photonics

E-Beam Litho • Dielectric Stacks

Medical Sensors

Biocompatible Films • Encapsulation

IoT & Actuators

MEMS Sensors • DRIE • Piezoelectrics

Expert-Led Processing

At Cleanroom Fab, you aren't just renting tool time. Your project is managed by senior process engineers who understand the physics of the tools. This allows for real-time adjustments, process optimization, and technical insights that automated production lines cannot provide.

TRL Advancement

Moving proof-of-concepts toward market readiness.

Process Stability

Removing tool-dependent variance for repeatability.

Engineering Oversight

Foundry-Compatible Capabilities

We utilize industry-standard toolsets and Class 100/10 cleanroom environments.

Design for Manufacturing (DFM) & Simulation

Reduce your development risk before the first wafer is processed. We offer COMSOL multiphysics modeling and FEA simulation to validate mechanical and electrical performance. Our DFM approach ensures your device architecture is optimized for high-yield fabrication.

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Lithography & Patterning

  • Maskless / Direct Write:  Heidelberg systems for rapid, mask-free prototyping.
  • Projection Steppers:  i-line / g-line (5:1 reduction) for high resolution.
  • Contact Alignment:  Front and backside alignment capabilities.
Silicon Wafer Pattern

Fig 1: 6-inch silicon wafer post-lithography patterning. Features down to 0.7µm.

SEM Deep Silicon Etch

Fig 2: Cross-section SEM of high-aspect-ratio Bosch DRIE performed on STS tools.

Etch (DRIE & RIE)

  • DRIE (Bosch Process):  High aspect ratio silicon etching.
  • Release Etching:  XeF2 isotropic silicon etch for suspended MEMS structures.

Thin Film Deposition

  • LPCVD/PECVD:  Oxide, Nitride, and Poly-Si.
  • PVD (Metals):  Au, Pt, Ti, Cr, Al, and Ni. Exotic targets available upon request.
Plasma Deposition Chamber

Fig 3: PECVD chamber during oxide deposition run.

The Production Bridge Roadmap

  • 1 Validation of baseline process recipes on industry-standard tools.
  • 2 Refinement of critical dimensions (CD) and yield optimization.
  • 3 Generation of a full Digital Process Traveler for foundry handover.

Scalability & The Path to Production

We don't just build your prototype; we build a scalable business. By utilizing industry-standard toolsets at the Lurie Nanofabrication Facility (LNF), we prioritize Foundry-Compatible processes. When your design is validated, we provide you with a full, transparent Digital Process Traveler to ensure a seamless transfer to high-volume commercial foundries.

Foundry Services FAQ

Technical clarifications for MEMS device prototyping.

Cleanroom Fab is the independent fabrication division of Spike Neuro. We operate as a strict "Work for Hire" foundry. Your IP is firewalled from our internal product teams, and you retain 100% ownership.

No. We provide commercial access to the LNF. We handle all tool reservations and training, prioritizing foundry-compatible processes for future scaling.

Start a Fabrication Run

Submit your specifications for a feasibility review and production roadmap.